The Challenge

Problem We Solve

Component shortages, counterfeit chips, and manufacturing defects cause severe production delays and budget overruns.

Key Deliverables

What You Receive

  • Turnkey prototype boards (Quick-turn 5–10 days)
  • Automated SMT assembly & 3D AOI/X-Ray inspection reports
  • Custom functional test jigs (Bed-of-Nails / Boundary Scan)
  • Scrubbed BOM with multi-distributor sourcing and alternates
  • Conformal coating, encapsulation, and enclosure assembly
Engineering Process

How We Deliver

Phase 1: BOM Procurement 1–2 Weeks

Sourcing through authorized distributors, counterfeit checks, and kitting.

Phase 2: Bare-Board Fab 3–7 Days

High-density interconnect (HDI) fab, impedance control, surface finishes.

Phase 3: SMT Assembly & Inspection 3–5 Days

Pick-and-place, reflow profiling, X-ray inspection of BGAs/QFNs, AOI checks.

Phase 4: Testing & Handoff 2–4 Days

Flashing firmware, functional testing, custom packaging, and delivery.

Technology Stack

Tools & Platforms

3D AOI X-Ray Inspection Bed-of-Nails Testing BOM Sourcing API IPC-A-610 Class 2/3
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