The Challenge

Problem We Solve

Unoptimized PCB layouts cause high EMI, thermal bottlenecks, difficult assembly, component obsolescence, and costly re-spins.

Key Deliverables

What You Receive

  • Complete multi-sheet schematics & design source files
  • Multi-layer PCB layout (Rigid, Flex, Rigid-Flex)
  • Signal & Power Integrity (SI/PI) simulation reports
  • Comprehensive Gerber, NC Drill, Pick-and-Place files
  • Scrubbed Bill of Materials (BOM) with lifecycle analysis
Engineering Process

How We Deliver

Phase 1: Circuit Design 1–2 Weeks

Schematic capture, power tree design, pin assignment, and design reviews.

Phase 2: Component Scrub 1 Week

BOM validation, second-source mapping, and lead-time risk mitigation.

Phase 3: PCB Layout & DFM 2–4 Weeks

Constraint-driven placement, impedance routing, thermal analysis, and fabrication checks.

Phase 4: Gerber Release 1 Week

Fab package generation, DRC verification, and fab house coordination.

Technology Stack

Tools & Platforms

Altium Designer OrCAD Cadence KiCad Enterprise HyperLynx SI/PI Ansys HFSS
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